JPH0388337U - - Google Patents
Info
- Publication number
- JPH0388337U JPH0388337U JP14925189U JP14925189U JPH0388337U JP H0388337 U JPH0388337 U JP H0388337U JP 14925189 U JP14925189 U JP 14925189U JP 14925189 U JP14925189 U JP 14925189U JP H0388337 U JPH0388337 U JP H0388337U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- tip
- type electronic
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14925189U JPH0388337U (en]) | 1989-12-25 | 1989-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14925189U JPH0388337U (en]) | 1989-12-25 | 1989-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388337U true JPH0388337U (en]) | 1991-09-10 |
Family
ID=31695664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14925189U Pending JPH0388337U (en]) | 1989-12-25 | 1989-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388337U (en]) |
-
1989
- 1989-12-25 JP JP14925189U patent/JPH0388337U/ja active Pending
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